Canadian Photonics Fabrication Centre

About the facility

The Canadian Photonics Fabrication Centre (CPFC) can fabricate devices in a variety of materials including:

• gallium arsenide (GaAs);
• indium phosphide (InP); and
• gallium nitride (GaN).

We offer foundry services or end-to-end fabrication of photonic devices, photonic integrated circuits and gallium nitride electronics. The CPFC can also develop new process technologies for our client's devices.

Why work with us

Leveraging intellectual property processes that have been developed throughout the years, we create custom manufacturable process flows for complex components in a short period of time.

In addition to fabrication, the CPFC can offer design and testing services and has a suite of quality control and failure analysis tools at its disposal for mid and post-process quality assurance and troubleshooting.

Our capabilities

The CPFC is a 40,000 square foot facility with 11,000 square feet of class 100/1000 clean room space providing a comprehensive suite of key processes and supporting activities.

Our team examines the client's requirements and advises on a suitable wafer structure and fabrication process to achieve the device performance necessary for their application. We can use either client-supplied photomasks or develop a new set of masks for the process sequence. A custom-designed manufacturing execution system is used for data collection and material tracking throughout the fabrication run. This helps ensure that all fabricated wafers are fully characterized and meet required specifications.

Additional capabilities

• Secondary Ion Mass Spectrometer (SIMS)
• Auger Nanoprobe (AES)
• X-Ray Photoelectron Spectrometer (XPS)
• Field-Emission Transmission Electron Microscope (TEM)
• Atomic Force Microscope (AFM)
• X-Ray Diffractometers (XRD)
• Dual Beam Focused-ion Beam (FIB)

Our services

• Foundry services: epitaxial growth (MOCVD, MBE, CBE), plasma enhanced chemical vapour deposition (PECVD), projection and E-beam lithography, metallization, plasma etching and back-end processing
• Design and modeling: for devices and circuits to improve yield, overall design and circuit performance
• Test and characterization: testing for optical and electronic devices, and surface and materials analysis